Mobile phones have become the necessities of modern life. The larger screen and the lighter fuselage is the developing trend of mobile phones. The miniaturization of mobile phone chips is a solution conforming to the development trend of mobile phones. All Puya products have leading competitiveness in die size, especially KGD products & WLCSP products which take the size advantage of our products to the extreme.
* Design-win SPI NOR Flash with lower power consumption and wide voltage for mobile Type-C and High-speed I/F.
* IIC EEPROM designed software write protection function and double perturbed address assignable function for CCM application.
* Mobile displays using AMOLED, TDDI combined with various density SPI NOR Flash allow ultimate slim and low power design.
* SPI NOR Flash
* IIC EEPROM
* VCM Driver